Connector and Method for Manufacturing Same

ABSTRACT

A connector includes: a circuit board; a first heat transfer material arranged on a principal surface of the circuit board; a first shell having an end mated with a mating connector in a state in which the terminal end portion of the circuit board protrudes from the end, and includes an opposite opposed to at least a part of a target region which is a region other than the terminal end portion, covers at least a part of the target region, and is conductive; a second shell connected to an end of the first shell, covers at least a part of the target region of the principal surface, and is thermally conductably connected to the circuit board in contact with the first heat transfer material; and a third shell engaged with the second shell, covers at least a part of the target region of a principal surface, and is conductive.

TECHNICAL FIELD

The present disclosure relates to a connector and a method ofmanufacturing the connector.

BACKGROUND ART

A speedup in communication through servers and the like has resulted inupsizing of connectors used in devices such as servers. Correspondingly,a connector described in Patent Literature 1 has been proposed in orderto downsize such connectors.

CITATION LIST Patent Literature

Patent Literature 1: Japanese Patent No. 4613484

SUMMARY OF INVENTION Technical Problem

However, it is necessary to dispose a spacer for suppressing theunsteadiness of a circuit board for transmission, between a shieldingcase and a circuit board for transmission in a connector described inPatent Literature 1. Therefore, it is difficult to downsize theconnector described in Patent Literature 1.

The present disclosure was made in view of the above-described problems,with an objective to provide a connector that can be downsized, and toprovide a method of manufacturing the connector.

Solution to Problem

In order to achieve the objective described above, a connector accordingto a first aspect of the present disclosure includes:

-   -   a circuit board that is connected to an outside via a signal        wire;    -   a first heat transfer material that is arranged on one principal        surface of the circuit board;    -   a first shell of which one end is mated with a mating connector        in a state in which a terminal end portion of the circuit board        protrudes from the one end, and which includes an opposite        opposed to at least a part of a target region which is a region        other than the terminal end portion of the circuit board, covers        at least a part of the target region, and is conductive;    -   a second shell that is connected to another end of the first        shell, covers at least a part of the target region in the one        principal surface of the circuit board, is thermally conductably        connected to the circuit board in contact with the first heat        transfer material, and is conductive; and    -   a third shell that is engaged with the second shell, covers at        least a part of the target region in another principal surface        of the circuit board, and is conductive,    -   wherein the first shell, the second shell, and the third shell        cover the target region of the circuit board.

It is also acceptable that the third shell is spaced from the firstshell in a direction along the one end, or in a direction along athickness direction of the circuit board, and opposed to the targetregion of the circuit board.

It is also acceptable that:

-   -   the first shell includes a cover that is connected to the        opposite, and forms, together with the opposite, an insertion        portion, and    -   the terminal end portion of the circuit board is inserted into        the insertion portion.

It is also acceptable that the first shell is formed integrally with thesecond shell.

It is also acceptable that the first shell is further formed integrallywith the third shell.

It is also acceptable that:

-   -   a heat generation member is arranged on the other principal        surface of the circuit board, and    -   a part of the third shell is thermally conductably connected to        the heat generation member via a second heat transfer material.

It is also acceptable that:

-   -   a tongue is formed in the third shell, and    -   the tongue is bent in contact with the second heat transfer        material.

It is also acceptable that the heat generation member is thermallyconductably connected to the circuit board via a third heat transfermaterial.

It is also acceptable that the heat generation member includes asemiconductor element including a silicon photonics circuit.

It is also acceptable that:

-   -   the signal wire includes an optical fiber,    -   the optical fiber is connected to a light emitting element or        light receiving element included in the semiconductor element,        and    -   an electric terminal of the semiconductor element is connected        to a plurality of connection terminals arranged on the terminal        end portion via a wiring line formed on the circuit board.

It is also acceptable that:

-   -   the second shell or the third shell includes an engager arranged        on one end thereof, and    -   the first shell includes a portion to be engaged, which is        arranged on the other end, and is engaged with the engager.

It is also acceptable that the first shell includes: an engagement clawthat is engaged with the circuit board; and a presser that presses theother principal surface of the circuit board.

It is also acceptable that an insertion opening into which the signalwire is inserted is opened in at least one of the second shell and thethird shell.

It is also acceptable that the first heat transfer material is afixation material with which the circuit board is fixed on the secondshell.

In order to achieve the objective described above, a connector accordingto a second aspect of the present disclosure includes:

-   -   a circuit board that is connected to an outside via a signal        wire;    -   a fixation member with which fixation of the circuit board is        performed;    -   a first shell of which one end is mated with a mating connector        in a state in which a terminal end portion of the circuit board        protrudes from the one end, and which covers at least a part of        a target region which is a region other than the terminal end        portion of the circuit board, and is conductive;    -   a second shell that is connected to another end of the first        shell, covers at least a part of the target region in one        principal surface of the circuit board, and is conductive; and    -   a third shell that is connected to the other end of the first        shell, is engaged with the second shell, covers at least a part        of the target region in another principal surface of the circuit        board, and is conductive, wherein    -   the first shell, the second shell, and the third shell cover the        target region of the circuit board, and    -   the fixation is performed with the fixation member so that at        least a part of the target region in the one principal surface        of the circuit board comes into contact with a principal surface        of the second shell.

In order to achieve the objective described above, a method ofmanufacturing a connector according to a third aspect of the presentdisclosure includes:

-   -   allowing a terminal end portion of a circuit board that is        connected to an outside via a signal wire to protrude from one        end of a first shell that is mated with a mating connector;    -   arranging a heat transfer material on one principal surface of        the circuit board;    -   engaging a second shell with the first shell and bringing the        second shell into intimate contact with the heat transfer        material; and    -   sliding a third shell along the second shell, engaging the third        shell with the first shell, and covering a region other than the        terminal end portion of the circuit board with the first shell,        the second shell, and the third shell,    -   wherein the first shell, the second shell, and the third shell        are fixed to each other.

In order to achieve the objective described above, a connector accordingto a fourth aspect of the present disclosure includes:

-   -   a circuit board that is connected to an outside via a signal        wire;    -   a thermally-conductive fixation material that is arranged on one        principal surface of the circuit board;    -   a first shell in which an insertion portion into which a        terminal end portion of the circuit board is inserted is formed        on one end, of which the one end is mated with a mating        connector in a state in which the terminal end portion of the        circuit board protrudes from the one end, and which covers at        least a part of a target region which is a region other than the        terminal end portion of the circuit board, and is conductive;    -   a second shell that is connected to another end of the first        shell, covers at least a part of the target region in the one        principal surface of the circuit board, comes into contact with        the fixation material to perform fixation of the circuit board,        and is conductive; and    -   a third shell that is connected to the other end of the first        shell, is engaged with the second shell, covers at least a part        of the target region in another principal surface of the circuit        board, and is conductive,    -   wherein the first shell, the second shell, and the third shell        cover the target region of the circuit board.

Advantageous Effects of Invention

In accordance with the present disclosure, a connector can be downsized,and the downsized connector can be manufactured.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1A is a plan view of a connector unit according to Embodiment 1 ofthe present disclosure;

FIG. 1B is a cross-sectional view of the connector unit, taken along theline IB-IB in FIG. 1A;

FIG. 2A is a perspective view of a connector according to Embodiment 1of the present disclosure;

FIG. 2B is a cross-sectional view of the connector, taken along the lineIIB-IIB in FIG. 2A;

FIG. 3A is a perspective view illustrating the skeletal form of a frontshell according to Embodiment 1 of the present disclosure;

FIG. 3B is an enlarged sectional perspective view of a portion IIIB inFIG. 2A;

FIG. 4A is a plan view of the front shell according to Embodiment 1 ofthe present disclosure;

FIG. 4B is a rear view of the front shell according to Embodiment 1 ofthe present disclosure;

FIG. 4C is a bottom view of the front shell according to Embodiment 1 ofthe present disclosure;

FIG. 4D is a perspective view of the front shell according to Embodiment1 of the present disclosure;

FIG. 4E is an enlarged perspective view of a portion obtained byomitting the +Z-side body of a portion E of FIG. 4A from the portion E;

FIG. 4F is a cross-sectional view of the front shell, taken along theline IVF-IVF in FIG. 4A;

FIG. 5A is a plan view of a lower shell according to Embodiment 1 of thepresent disclosure;

FIG. 5B is a perspective view of the lower shell according to Embodiment1 of the present disclosure;

FIG. 6A is a bottom view of an upper shell according to Embodiment 1 ofthe present disclosure;

FIG. 6B is a perspective view of the upper shell according to Embodiment1 of the present disclosure;

FIG. 6C is a cross-sectional view of the upper shell, taken along theline VIC-VIC in FIG. 6A;

FIG. 7A is a perspective view of a circuit board and a signal wireaccording to Embodiment 1 of the present disclosure;

FIG. 7B is a side view of the circuit board and the signal wireaccording to Embodiment 1 of the present disclosure;

FIG. 8A is a perspective view of a state before the circuit board isinserted into the front shell;

FIG. 8B is a perspective view of a state after the circuit board isinserted into the front shell;

FIG. 9 is an enlarged sectional perspective view of a state in which thecircuit board is inserted into the front shell of FIG. 4F;

FIG. 10A is a perspective view of a state before the lower shell isengaged with the front shell;

FIG. 10B is a perspective view of a state after the lower shell isengaged with the front shell;

FIG. 11 is an enlarged sectional perspective view of a portion obtainedby omitting the +Z-side body of the front shell of FIG. 10B from aportion XI;

FIG. 12A is a perspective view of a state before the upper shell isengaged with the front shell;

FIG. 12B is a perspective view of a state after the upper shell isengaged with the front shell;

FIG. 13A is a perspective view of a lower shell, a front shell, and acircuit board according to Alternative Example 1 of the presentdisclosure;

FIG. 13B is a cross-sectional view of the lower shell, the front shell,and the circuit board, taken along the line XIIIB-XIIIB in FIG. 13A;

FIG. 14A is a perspective view of a lower shell and a front shellaccording to Alternative Example 2 of the present disclosure;

FIG. 14B is a cross-sectional view of the lower shell and the frontshell, taken along the line XIVB-XIVB in FIG. 14A;

FIG. 15A is a perspective view of a circuit board according toAlternative Example 2 of the present disclosure;

FIG. 15B is a cross-sectional view of the circuit board, taken along theline XVB-XVB in FIG. 15A;

FIG. 16A is a perspective view of the lower shell, the front shell, andthe circuit board according to Alternative Example 2 of the presentdisclosure;

FIG. 16B is a cross-sectional view of the lower shell, the front shell,and the circuit board, taken along the line XVIB-XVIB in FIG. 16A;

FIG. 17 is a perspective view of a state in which the housing of aconnector according to Embodiment 2 of the present disclosure is opened;

FIG. 18A is a plan view of the connector according to Embodiment 2 ofthe present disclosure;

FIG. 18B is a cross-sectional view taken along the line XVIIIB-XVIIIB ofFIG. 18A;

FIG. 19 is a view illustrating a method of manufacturing the connectoraccording to Embodiment 2 of the present disclosure, in which FIG. 19Ais a perspective view in a case in which a circuit board is placed in ahousing, and FIG. 19B is a perspective view in a case in which an uppershell is mated with a lower shell;

FIG. 20 is an exploded perspective view of a connector according toEmbodiment 3 of the present disclosure;

FIG. 21A is a perspective view of a connector according to Embodiment 4of the present disclosure;

FIG. 21B is an enlarged plan view of a portion B of FIG. 21A; and

FIG. 22 is an exploded perspective view of the connector according toEmbodiment 4 of the present disclosure.

DESCRIPTION OF EMBODIMENTS

A connector unit including a connector according to each embodiment ofthe present disclosure will be described below with reference to thedrawings. In the drawings, the XYZ coordinates orthogonal to each otherare set, and reference to the XYZ coordinates is made as appropriate.The Y-axis direction of the XYZ coordinates is a direction(forward-backward direction) identical to a mating direction D1 in whicha connector 10 is moved to be mated with a mating connector 20, asillustrated in FIG. 1A. The Z-axis direction is a direction(upward-downward direction) identical to the thickness direction of thecircuit board 200 of the connector 10. The X-axis direction is adirection (crosswise direction) orthogonal to both the Y-axis and Z-axisdirections. The same components are denoted by the same referencecharacters.

Embodiment 1

A connector unit 1 is, for example, a unit for an active optical cable(AOC) connector used in a graphic processing unit (GPU), a fieldprogrammable gate array (FPGA), or the like in a server. The connectorunit 1 includes the connector 10 and the mating connector 20 accordingto Embodiment 1.

The connector 10 is a male connector that is connected to the matingconnector 20 which is a female connector, as illustrated in FIG. 1A.

As illustrated in a cross section, taken along the line IB of FIG. 1A,in FIG. 1B, the connector 10 includes: the circuit board 200 on which aprinted circuit is formed; a semiconductor element 210 arranged on thecircuit board 200; a signal wire 300 connected to the semiconductorelement 210; and a housing 100 that houses the circuit board 200excluding a terminal end portion 201 and the base of the signal wire300. The mating connector 20 is connected to connection terminals 203(see FIG. 7) aligned on the terminal end portion 201 of the circuitboard 200.

The connector 10 receives an optical signal through the signal wire 300,and allows the semiconductor element 210 mounted on the circuit board200 to convert the optical signal into an electric signal, and toprocess the electric signal. Then, the electric signal is transmitted tothe mating connector 20 through the printed circuit on the circuit board200 and the connection terminals 203 aligned on the terminal end portion201. Moreover, the connector 10 transmits the electric signal,transmitted from the mating connector 20, to the semiconductor element210 through the printed circuit and the connection terminals 203 alignedon the terminal end portion 201. Then, the semiconductor element 210processes the electric signal, the electric signal is converted into anoptical signal, and the optical signal is transmitted to the outsidethrough the signal wire 300.

The configuration of the connector 10 will now be described in moredetail.

-   -   As illustrated in FIG. 2A and FIG. 2B which is a cross-sectional        view taken along the line IIB of FIG. 2A, the connector 10        includes: the circuit board 200; the semiconductor element 210        arranged on the circuit board 200; the signal wire 300 that is        connected to the semiconductor element 210; and the housing 100        that houses the circuit board 200 excluding the terminal end        portion 201 and the base of the signal wire 300.

The housing 100 is, for example, a conductive member including a metal.The housing 100 houses the circuit board 200 excluding the terminal endportion 201. The housing 100 includes: a front shell 110 that allows theterminal end portion 201 of the circuit board 200 to protrude; a lowershell 120 with which the lower portion of the circuit board 200 isfixed; and an upper shell 130 that is arranged in the upper portion ofthe circuit board 200. The front shell 110 is an example of a firstshell, the lower shell 120 is an example of a second shell, and theupper shell 130 is an example of a third shell.

The front shell 110 is a member that allows the terminal end portion 201of the circuit board 200 to protrude to the (forward) outside of thehousing 100, and covers the circuit board 200. In a skeletal form asillustrated in FIG. 3A, the front shell 110 includes: a body 111 havinga square cylindrical shape; and a generally C-shaped latch 115 that isrotatably locked on both ends of the body 111 in the X-axis direction.

Specifically, the front shell 110 includes the body 111 and the latch115, as illustrated in a plan view in FIG. 4A and in a perspective viewin FIG. 4D.

The body 111 is included in the body portion of the front shell 110, andan insertion portion 111 a corresponding to a hollow portion thatpenetrates the body 111 in the Y-axis direction (forward-backwarddirection) is formed in the body 111. As illustrated in FIG. 1B, thefront end (one end) 117 of the body 111, together with the terminal endportion 201 of the circuit board 200, is mated with the mating connector20. As illustrated in FIG. 4F, the rear end (other end) 118 of the body111 is formed so as to spread in the Z-axis direction (upward-downwarddirection), in order to form a space for inserting the circuit board 200into the front shell 110. As illustrated in FIG. 2B and FIG. 4F, thebody 111 includes: an opposite 111 b that is opposed to one principalsurface 204, described below, of the circuit board 200; a cover 111 cthat is opposed to another principal surface 205, described below, ofthe circuit board 200; and connections 111 d that connect the opposite111 b and the cover 111 c to each other. The opposite 111 b and thecover 111 c are arranged to be opposed to each other in the state ofbeing apart from each other in the Z-axis direction (upward-downwarddirection). The connections 111 d connect an end of the opposite 111 bin the +Y-direction (forward direction) and an end of the cover 111 c inthe +Y-direction (forward direction) to each other. The connections 111d are disposed on both ends of the front end 117 of the body 111 in theX-axis direction, respectively. In the front end (one end) 117 of thebody 111, the insertion portion 111 a is formed by the opposite 111 b,the cover 111 c, and the connections 111 d.

As illustrated in FIGS. 1 and 2, the terminal end portion 201 of thecircuit board 200 is inserted into the insertion portion 111 a, and theterminal end portion 201 protrudes from the front end 117 of the frontshell 110.

As illustrated in FIG. 4A and FIG. 4E which is an enlarged view of theportion e of FIG. 4A, portions to be engaged 112 which is a plate-shapedmember including a principal surface in the XZ plane are formed on bothends of the body 111 in the X-axis direction (crosswise direction). Theengagers 123, described below, of the lower shell 120 are engaged withthe portions to be engaged 112.

As illustrated in FIGS. 4C and 4F, engagement claws 113 which arehook-shaped members that protrude into the insertion portion 111 a areformed in the vicinities of both ends of the body 111 in the X-axisdirection (crosswise direction). The engagement claws 113 are engagedwith the projections 202, described below, of the circuit board 200inserted into the insertion portion 111 a, and prevent the circuit board200 from falling out of the front shell 110.

As illustrated in FIGS. 4A, 4D, and 4F, pressers 114 that press thecircuit board 200 inserted into the insertion portion 111 a are formedin the vicinities of both ends of the upper wall of the body 111 in theX-axis direction (crosswise direction). Each of the pressers 114 isformed of an L-shaped tongue that has elasticity, and protrudes from thebody 111 toward the interior of the insertion portion 111 a. As aresult, the pressers 114 press, in the −Z-direction, the circuit board200 inserted into the insertion portion 111 a.

As illustrated in FIGS. 4C and 4D, soldering portions 116 a are formedin the −Z-side (lower side) of the rear end 118 of the body 111. Thesoldering portions 116 a include concave portions in the XY plane view.The deviations of the front shell 110 and the lower shell 120 in theY-axis-direction (forward-backward direction) are suppressed byarranging the protrusions 125, described below, of the lower shell 120in the concave portions of the soldering portions 116 a. Moreover, gapsbetween the soldering portions 116 a and the protrusions 125 aresoldered to fix the front shell 110, the lower shell 120, and thecircuit board 200 to each other.

As illustrated in FIGS. 4A, 4D, and 4F, an abutment 116 b is formed inthe +Z-side (upper side) of the rear end 118 of the body 111. Theabutment 116 b includes a plate-shaped tongue portion, and the tongueportion is in the vicinity of the other principal surface 205 of thecircuit board 200. When the upper shell 130 is mounted on the frontshell 110, the tongue portion of the abutment 116 b of the front shell110 abuts on the −Y-direction (backward direction) end of the abutment137, described below, of the upper shell 130, as illustrated in FIG. 3B.

As illustrated in FIGS. 4A and 4D, recesses 119 are disposed in the+Z-side (upper side) of the front end 117 of the body 111. The recesses119 are recessed in the −Z-direction (downward direction). Theprojections (not illustrated) of the mating connector 20 are mated withthe recessed portions of the recesses 119 in a state in which theconnector 10 is connected to the mating connector 20.

As illustrated in FIG. 4E, the latch 115 is a generally C-shaped memberof which both ends are rotatably engaged with both ends of the body 111in the X-axis direction (crosswise direction). The latch 115 is hookedon a wall surface 21 of the mating connector 20 in the +Y-direction(forward direction) by rotationally moving the latch 115 in the D2direction in a state in which the terminal end portion 201 of thecircuit board 200 is connected to the mating connector 20, asillustrated in FIG. 1B. As a result, the latch 115 prevents the circuitboard 200 from falling out of the mating connector 20.

The lower shell 120 included in the housing 100 includes a base 121,risers 122, and the engagers 123 in a pair, as illustrated in FIGS. 5Aand 5B. The lower shell 120 is a member that covers at least a part of atarget region which is a region other than the terminal end portion 201of the circuit board 200, and supports the circuit board 200.

The base 121 is a flat-plate-shaped member having a generallyrectangular shape. The circuit board 200 is arranged on a principalsurface 121 a of the base 121 via a fixation material 400 describedbelow.

The protrusions 125 in a pair are formed on the +Y-direction (front) endof the base 121. The protrusions 125 are flat-plate-shaped members thatare arranged in the recesses of the soldering portions 116 a disposed inthe −Z-side (lower side) of the rear end 118 of the front shell 110 in acase in which the lower shell 120 is engaged with the front shell 110.

A soldering portion 126 is formed in the +Y-direction (front) centralportion of the base 121. The soldering portion 126 includes recesses forfixing the front shell 110, the lower shell 120, and the circuit board200 with solder.

The risers 122 are members that form walls rising from both X-directionends and −Y-direction (rear and side) ends of the base 121.

A plurality of engagement holes 124 is formed in the riser 122 of the−Y-direction end (rear end). Each of the engagement holes 124 is formedin a generally rectangular shape. The engagers 136, described below, ofthe upper shell 130 are engaged with the engagement holes 124.

The engagers 123 are hook-shaped members formed in the +Y-direction ends(front ends) in the risers 122 of both the X-axis-direction ends (bothcrosswise-direction ends). As illustrated in FIG. 11, the engagers 123are engaged with the portions to be engaged 112 in a state in which thelower shell 120 is connected to the front shell 110. The engagers 123have structures in which the engagers 123 are prevented from easilyfalling out of the portions to be engaged 112 when the engagers 123 areengaged with the portions to be engaged 112, because the hook-shapedportions of the engagers 123 in a pair are outwardly formed, and theportions to be engaged 112 in a pair are formed outside the engagers123.

Moreover, the upper shell 130 included in the housing 100 includes abase 131, risers 132, a tongue 133, and the abutment 137, as illustratedin FIGS. 6A to 6C. The upper shell 130 covers at least a part of thetarget region (the region other than the terminal end portion 201) ofthe circuit board 200.

The base 131 is a flat-plate-shaped member having a generallyrectangular shape, of which the vicinity of the center is incised toform the tongue 133. The lengths of the short and long sides of the base131 of the upper shell 130 are slightly longer than the lengths of theshort and long sides of the base 121 of the lower shell 120,respectively. As a result, the upper shell 130 can house the upper endsof the risers 122 of the lower shell 120.

The tongue 133 is a member having a generally square shape in the XYplane view, which is formed to be bent from the base 131 toward the−Z-direction (the downward direction, the direction toward a place inwhich the semiconductor element 210 is arranged). The tongue 133 is amember for promoting dissipation of heat from the semiconductor element210, described below, of the circuit board 200. A gap 134 is formedbetween the base 131 and the tongue 133, and air in the housing 100,heated by the semiconductor element 210, is released from the gap 134 tothe outside.

The risers 132 are members that form wall surfaces rising from foursides of both X-direction ends and both Y-direction ends of the base131. Both the X-direction ends and the −Y-direction end (crosswisedirection and backward direction) of the risers 132 of the upper shell130 are arranged to overlap both the X-direction ends and the−Y-direction end (crosswise direction and backward direction) of therisers 122 of the lower shell 120.

An insertion opening 135 for passing the signal wire 300 is formed inthe vicinity of the center of the −Y-direction (backward-direction) wallof the risers 132.

Moreover, a plurality of engagers 136 is formed toward the +Y direction(forward direction) on the top (end in the −Z-direction) of the−Y-direction (backward-direction) wall of the risers 132. Each engager136 is a member having a generally rectangular shape. The engagers 136are engaged with the engagement holes 124 formed in the riser 122 of thelower shell 120.

An abutment 137 is a plate-shaped member formed on the −Z-direction end(lower end) of the riser 132 of the +Y-direction end (front end). Theabutment 137 of the upper shell 130 abuts on the +Z-direction surface ofthe body 111 of the front shell 110 and the abutment 116 b of the frontshell 110.

A plurality of recesses 138 having a concave shape is formed on the+Y-direction (forward-direction) end of the abutment 137. Portionsbetween the recesses 138, 138 adjacent to each other are soldered to fixthe upper shell 130 to the front shell 110 in a state in which theabutment 137 of the upper shell 130 abuts on the front shell 110.

The circuit board 200 is an active optical cable (AOC) substrate, andincludes the projections 202 in a pair and the connection terminals 203,as illustrated in FIGS. 7A and 7B.

The circuit board 200 is fixed on the principal surface 121 a of thelower shell 120 via the fixation material 400, as illustrated in FIG.2B, and is thermally conductably connected to the lower shell 120.

The terminal end portion 201 is the +Y-side (front-side) end of thecircuit board 200, as illustrated in FIGS. 7A and 7B. The terminal endportion 201 is a portion that protrudes from the front end 117 of thefront shell 110 when the circuit board 200 is inserted from the rear end118 into the front shell 110 in the +Y-direction (forward direction).

The projections 202 are portions formed to protrude outward from boththe X-axis-direction (crosswise-direction) ends of the terminal endportion 201. As illustrated in FIG. 9, the projections 202 are engagedwith the hook-shaped portions of the engagement claws 113 to prevent thecircuit board 200 from falling out of the front shell 110 in a state inwhich the circuit board 200 is inserted to a predetermined position inthe insertion portion 111 a.

The plurality of connection terminals 203 is formed on the otherprincipal surface 205 of the terminal end portion 201, as illustrated inFIGS. 7A and 7B. The connection terminals 203 are connected to theconnection terminals of the mating connector 20.

The semiconductor element 210 is a heat generation member including asilicon photonics circuit, includes a light emitting element 212, alight receiving element 213, an electric terminal, and the like, and ismounted on the circuit board 200. For example, a laser diode (LD) as thelight emitting element 212, for example, a photo diode (PD) as the lightreceiving element 213, and, in addition, a component such as a driverare integrated in the silicon photonics circuit. The electric terminalof the semiconductor element 210 is connected to the connectionterminals 203 arranged on the terminal end portion 201 through a wiringline formed on the circuit board 200. The semiconductor element 210 isthermally conductably connected to the tongue 133 of the upper shell 130via a heat transfer material 410, as illustrated in FIG. 2B. Moreover,the semiconductor element 210 is thermally conductably connected to thecircuit board 200 via a heat transfer material 420 on the otherprincipal surface 205 of the circuit board 200.

The signal wire 300 includes an optical fiber 301 and a connection 302,as illustrated in FIGS. 7A and 7B. One end of the optical fiber 301 isconnected to the connection 302, and the other end of the optical fiber301 is connected to an external portion (external instrument or thelike). The connection 302 is connected to the semiconductor element 210.A reflecting mirror 303 is arranged on the connection 302. Thereflecting mirror 303 reflects and bends light emitted from the opticalfiber 301 or light emitted from the light emitting element 212. Thereflecting mirror 303 allows the semiconductor element 210 and thesignal wire 300 to be connected to each other to enable transmission oflight.

The fixation material 400 includes an adhesive, for example, a silverpaste, of which the heat transfer property is higher than that of acommon adhesive made of resin. The fixation material 400 is filledbetween the one principal surface 204 of the circuit board 200 includinga portion just under the semiconductor element 210 and the principalsurface 121 a of the base 121 of the lower shell 120, as illustrated inFIG. 2B. When a wiring line is also formed on the one principal surface204 of the circuit board 200, a surface of the wiring line is subjectedto insulation processing. The fixation material 400 has the function offixing the circuit board 200 on the lower shell 120, and the function oftransmitting heat from the circuit board 200 to the lower shell 120 todissipate the heat. The fixation material 400 is not limited to a solid,but may be sol, gel, or the like. For example, heat dissipation greasesuch as heat conduction grease, a heat dissipation sheet, or the likemay be used (an example of a first heat transfer material).

The heat transfer materials 410 and 420 are thermally-conductivemembers, and, for example, a silver paste is used in the heat transfermaterials 410 and 420 in the present embodiment.

The heat transfer material 410 performs the function of transmittingheat generated in the semiconductor element 210 to the tongue 133 of theupper shell 130 to dissipate the heat in the whole upper shell 130. Theheat transfer material 410 is an example of a second heat transfermaterial.

The heat transfer material 420 performs the function of transmittingheat generated in the semiconductor element 210 to the circuit board 200and transmitting the heat from the circuit board 200 to the lower shell120 through the fixation material 400 to dissipate the heat in the wholelower shell 120. The heat transfer material 420 is an example of a thirdheat transfer material.

As illustrated in FIGS. 1A and 1B, the mating connector 20 is a femaleconnector mounted on a substrate (not illustrated). The terminal endportion 201 of the circuit board 200 that protrudes from the connector10 is inserted into the mating connector 20.

The mating connector 20 may include a configuration corresponding to theconnector 10. The configuration of the female connector illustrated inFIGS. 1A and 1B is an example, and the shape and the like of the matingconnector 20 can be changed as appropriate.

(Method of Manufacturing Connector 10)

A method of manufacturing the connector 10 including the configurationdescribed above will now be described.

First, an operator connects the semiconductor element 210 to a contactpad on the other principal surface 205 of the circuit board 200 in whichprinted wiring and the connection terminals 203 are formed in advance onthe terminal end portion 201.

Then, the heat transfer material 420 is filled between the circuit board200 and the semiconductor element 210. Subsequently, the connection 302of the signal wire 300 is connected to the predetermined position of theprincipal surface 211 of the semiconductor element 210, therebyresulting in a state illustrated in FIGS. 7A and 7B.

As illustrated in FIG. 8A, the operator inserts the terminal end portion201 of the circuit board 200 into the insertion portion 111 a of thefront shell 110 while directing the other principal surface 205 at the+Z-direction (upward direction). The terminal end portion 201 of thecircuit board 200 protrudes from the front end 117, thereby resulting ina state illustrated in FIG. 8B. In such a case, the circuit board 200overrides the engagement claws 113 (pushes the engagement claw 113 inthe −Z-direction and the downward direction) while bending the pressers114 in the +Z-direction (upward direction), and the projections 202 ofthe circuit board 200 are then engaged with the engagement claws 113 ofthe front shell 110, as illustrated in FIG. 9. Moreover, the circuitboard 200 is pressed in the −Z-direction by the pressers 114. When thecircuit board 200 is not accurately inserted to the predeterminedposition in the insertion portion 111 a, the projections 202 interferewith the +Z-direction rising portion of the engagement claws 113, andpush the engagement claws 113 in the D4 direction (−Z-direction).Accordingly, whether the circuit board 200 is inserted to thepredetermined position can be confirmed depending on whether or not theengagement claws 113 protrude in the D4 direction. After the insertion,the soldering portions 116 a illustrated in FIGS. 4B and 4D, and thecircuit board 200 are soldered to each other.

The operator applies the fixation material 400 to the one principalsurface 204 of the circuit board 200. As illustrated in FIG. 10A, theoperator slides the lower shell 120 along the one principal surface 204of the circuit board 200 in the D3 direction to engage the engagers 123of the lower shell 120 with the portions to be engaged 112 disposed onthe rear end 118 of the front shell 110 (FIG. 11). In such a case, theone principal surface 204 of the circuit board 200 is fixed on theprincipal surface 121 a of the lower shell 120 via the fixation material400, and the circuit board 200 is thermally conductably connected to thelower shell 120, thereby resulting in a state as illustrated in FIG.10B.

The operator applies the heat transfer material 410 to a region otherthan a portion to which the connection 302 of the principal surface 211of the semiconductor element 210 illustrated in FIG. 7 is connected.

As illustrated in FIG. 12A, the operator slides the upper shell 130 inthe D3 direction along the other principal surface 205 of the circuitboard 200. The abutment 137 of the upper shell 130 abuts on the rear end118 of the body 111 of the front shell 110. Moreover, the engagers 136are engaged with the engagement holes 124 of the lower shell 120. Therisers 132 of the upper shell 130 are mated with the risers 122 of thelower shell 120, and the mated portions and the body 111, and theabutment 137 of the upper shell 130 are soldered to each other, therebyresulting in a state illustrated in FIG. 12B, to accomplish theconnector 10.

The connector 10 of the present embodiment eliminates the need of aspacer for suppressing the unsteadiness of the circuit board 200 becausethe circuit board 200 is fixed on the lower shell 120 with the fixationmaterial 400 having thermal conductivity. Accordingly, the connector 10can be downsized. Moreover, the need for the lower shell 120 to includea heat sink for promoting dissipation of heat from the circuit board 200is reduced. In addition, the connector 10 can be downsized in a case inwhich there is no need for a heat sink. In addition, the front end 117of the body 111 of the front shell 110, in place of the circuit board200, is mated with the mating connector 20, and therefore, strengthrequired in the circuit board 200 is decreased. Accordingly, the circuitboard 200 can be thinned, and the connector 10 can be downsized.

In the connector 10 of the present embodiment, the semiconductor element210 is thermally conductably connected to the tongue 133 of the uppershell 130 via the heat transfer material 410. Therefore, heat generatedby the semiconductor element 210 is diffused across the upper shell 130through the tongue 133, and heat dissipation is promoted. Accordingly,the need for the upper shell 130 to include a heat sink is reduced. Inaddition, the connector 10 can be further downsized in a case in whichthere is no need for a heat sink.

In the connector 10 of the present embodiment, the semiconductor element210 is thermally conductably connected to the circuit board 200 via theheat transfer material 420. Therefore, heat generated by thesemiconductor element 210 is diffused to the lower shell 120 through thecircuit board 200, and heat dissipation is promoted. Accordingly, theneed for the housing 100 to include a heat sink is reduced. In addition,the connector 10 can be further downsized in a case in which there is noneed for a heat sink.

In the connector 10 of the present embodiment, the semiconductor element210 includes a silicon photonics circuit. In the silicon photonicscircuit, components such as the LD, the PD, and the driver areintegrated, and therefore, the connector 10 can be downsized.

In the connector 10 of the present embodiment, the signal wire 300includes the optical fiber 301, and the optical fiber 301 is connectedto the light emitting element 212 or the light receiving element 213included in the semiconductor element 210. As a result, the siliconphotonics circuit can be used in the semiconductor element 210, and theconnector 10 can be further downsized.

In the connector 10 of the present embodiment, the lower shell 120includes the engagers 123 in the front end 117, and the front shell 110includes, in the rear end 118, the portions to be engaged 112 that areengaged with the engagers 123. Accordingly, the lower shell 120 can betightly fixed on the front shell 110 by being fixed on the circuit board200 and by being locked on the front shell 110. Thus, the connector 10can be downsized, and the strength of the housing 100 of the connector10 can be improved.

In the connector 10 of the present embodiment, the front shell 110includes: the engagement claws 113 that are engaged with the circuitboard 200; and the pressers 114 that press the other principal surface205 of the circuit board 200. Thus, the circuit board 200 is preventedfrom falling out of the front shell 110, and the other principal surface205 is pressed by the front shell 110. Therefore, it is not necessary tofix, on the circuit board 200, the upper shell 130 that is connected tothe front shell 110 and engaged with the lower shell 120. Accordingly, aspace for fixing the upper shell 130 and the circuit board 200 is notneeded in the connector 10, and therefore, the connector 10 can befurther downsized. Moreover, the circuit board 200 is more reliablyfixed on the front shell 110.

In the connector 10 of the present embodiment, the insertion opening 135into which the signal wire 300 is inserted is formed in the upper shell130. Accordingly, the connector 10 can be further downsized because itis not necessary to dispose a gap for passing the signal wire 300 to theoutside between the front shell 110, the lower shell 120, and the uppershell 130, and the housing 100 can be downsized.

Embodiment 2

As illustrated in FIG. 17, the housing 100C of a connector 10C accordingto Embodiment 2 differs from that of Embodiment 1 in that: a front shell110C rotatably opens and closes in the D5 direction; a lower shell 120Cis formed integrally with the front shell 110C in the +X-side; an uppershell 130C is formed integrally with the front shell 110C in the−X-side; and a locker 1301C is formed on the upper shell 130C, and aportion to be locked 1204C is formed on the lower shell 120C. In otherwords, the housing 100C is one component in the present embodiment. In acase in which no description is provided for a certain respect, the sameas that of Embodiment 1 applies.

In the front shell 110C, a body 111C opens and closes about the X-axisbetween connections 1113C at both X-axis-direction ends of a front end(one end) 117. The body 111C includes an opposite 1111C, a cover 1112C,and the connections 1113C.

As illustrated in a cross-sectional view in FIG. 18B, the opposite 1111Cis arranged to be opposed to one principal surface 204 of a circuitboard 200. The opposite 1111C is formed integrally with the lower shell120C. As illustrated in FIG. 17, the cover 1112C is connected to theopposite 1111C by the connections 1113C disposed on both theX-axis-direction ends of the front end 117 of the body 111C, to form theopposite 1111C, the connections 1113C, and an insertion portion 1114C.The cover 1112C is formed integrally with the upper shell 130C. Thecover 1112C is opposed to the other principal surface 205 of the circuitboard 200. Bending or stretching of the connections 1113C results inopening or closing of the front shell 110C. As illustrated in a planview in FIG. 18A and the cross-sectional view in FIG. 18B, the terminalend portion 201 of the circuit board 200 is inserted into the insertionportion 1114C.

As illustrated in FIG. 17, a generally U-shaped mater 1115C formed onboth the X-axis-direction ends of the opposite 1111C is mated with thegenerally U-shaped portion to be mated 1116C of the cover 1112C, wherebythe front shell 110C becomes in a closed state. In the inside of themater 1115C, both ends of a latch 115 are engaged, and the mater 1115Cis mated with the portion to be mated 1116C, whereby the latch 115 isrotatably attached to the body 111C.

The lower shell 120C differs from the lower shell 120 of Embodiment 1 inthat: the lower shell 120C includes none of the engagers 123, theengagement holes 124, the protrusions 125, and the soldering portion126; and the lower shell 120C includes a signal wire insertion portion1201C into which a signal wire 300 is inserted. The signal wireinsertion portion 1201C includes: a signal wire abutment 1202C thatabuts on the signal wire 300; and a signal wire insertion hole 1203Cinto which the signal wire 300 is inserted. Moreover, the lower shell120C includes portions to be locked 1204C in a riser 122 in a−Y-direction end. The portions to be locked 1204C protrude in a slightlyprojection shape in the +Y-direction. Lockers 1301C described below arelocked on the projections of the portions to be locked 1204C.

The upper shell 130C differs from the upper shell 130 of Embodiment 1 inthat the upper shell 130C includes neither the engagers 136 nor therecesses 138. The upper shell 130C also differs from the upper shell 130in that the upper shell 130C includes the lockers 1301C that are lockedon the portions to be locked 1204C. The lockers 1301C are formed in ariser 132 in a −Y-direction end to slightly protrude in the+Y-direction. The projections of locker 1301C are locked over theprotuberances of the portions to be locked 1204C.

(Method of Manufacturing Connector 10C)

First, an operator inserts the terminal end portion 201 of the circuitboard 200 into the insertion portion 1114C in a state in which the uppershell 130C is opened from the lower shell 120C, and places the circuitboard 200 on the lower shell 120C via a fixation material 400 (or a heattransfer material) while allowing the terminal end portion 201 toprotrude, as illustrated in FIG. 19A. Then, the upper shell 130C ismated with the lower shell 120C, and the mater 1115C with which thelatch 115 is engaged is mated with the portion to be mated 1116C, asillustrated in FIG. 19B. The lockers 1301C are locked on the portions tobe locked 1204C, to accomplish the connector 10C.

In the connector 10C of the present embodiment, the housing 100C of theconnector 10C is one component, and therefore, the connector 10C can bemore easily manufactured, and can be allowed to be smaller than theconnector 10 of Embodiment 1, in which the front shell 110, the lowershell 120, and the upper shell 130, which are three components, areassembled.

Embodiment 3

As illustrated in an exploded perspective view in FIG. 20, the housing100D of a connector 10D according to Embodiment 3 differs from that ofEmbodiment 2 in that: a front shell 110D can be separated into twoportions; a heat exchanger plate 430 is disposed instead of the tongue133; and locking pawls 1201D are disposed on a lower shell 120D. For theother respects, the same as that of Embodiment 2 applies. In otherwords, the housing 100D can be separated into two components in thepresent embodiment.

The front shell 110D includes a body 111D and a latch 115. The body 111Dincludes: a lower body 1111D included in the lower portion of the body111D; and an upper body 1112D included in the upper portion of the body111D. The connections 1113C on both the X-axis-direction ends of thefront end (one end) 117 of Embodiment 2 are divided into the lowerconnections 1114D of the lower body 1111D and the upper connections1116D of the upper body 1112D in the present embodiment.

The lower body 1111D includes: an opposite 1113D that is opposed to acircuit board 200; and the lower connections 1114D that is connected tothe upper body 1112D. The opposite 1113D is opposed to one principalsurface 204 of the circuit board 200, and is connected to the lowershell 120D. The lower connections 1114D are formed on both theX-axis-direction ends of the front end (one end) 117 of the lower body1111D, and are connected to the upper connections 1116D, describedbelow, of the upper body 1112D. Like the body 111C, the lower body 1111Dincludes U-shaped maters 1115C, and both ends of the latch 115 areengaged with the maters 1115C.

The upper body 1112D includes: a cover 1115D that is opposed to theother principal surface 205 of the circuit board 200; and the upperconnections 1116D that are connected to the lower body 1111D. The cover1115D is connected to the opposite 1113D via the upper connections 1116Dand the lower connections 1114D, and forms an insertion portion togetherwith the opposite 1113D, the upper connections 1116D, and the lowerconnections 1114D. The cover 1115D is connected to an upper shell 130D.Like the body 111C, the upper body 1112D includes U-shaped portions tobe mated 1116C. The maters 1115C are mated with the portions to be mated1116C, and the latch 115 is rotatably attached to the body 111D.

The lower shell 120D is formed integrally with the lower body 1111D, andis mated with the upper shell 130. The locking pawls 1201D are disposedon the +Y-direction ends of the risers 122 of the lower shell 120D. Thelocking pawls 1201D are locked on the +Y-direction ends of the portionsto be mated 1116C of the upper shell 130D to suppress movement of theupper shell 130D in the +Y-direction. The upper shell 130D is formedintegrally with the upper body 1112D. A tongue is not formed on theupper shell 130D, but the heat exchanger plate 430 is disposed, in placeof the tongue, between the upper shell 130D and the circuit board 200.For example, a phase change material (PCM) is used in the heat exchangerplate 430 in the present embodiment.

(Method of Manufacturing Connector 10D)

First, an operator places the circuit board 200 on the lower shell 120Dvia a heat transfer material (not illustrated) while allowing theterminal end portion 201 of the circuit board 200 to protrude from thefront end (one end) 117 of the lower body 1111D to the lower body 1111Dand the lower shell 120D. Then, the upper shell 130D is mated with thelower shell 120D, and the maters 1115C with which the latch 115 isengaged are mated with the portions to be mated 1116C, to accomplish theconnector 10D.

In the connector 10D of the present embodiment, the housing 100D of theconnector 10D is assembled by mating two components, and therefore, theconnector 10D can be more easily manufactured, and can be allowed to besmaller than the connector 10 of Embodiment 1, in which the front shell110, the lower shell 120, and the upper shell 130, which are threecomponents, are assembled.

Embodiment 4

As illustrated in FIGS. 21A, 21B, and 22, the housing 100E of aconnector 10E according to Embodiment 4 differs from the housing 100D ofEmbodiment 3 in that: a front shell 110E does not include the upper body1112D of Embodiment 3; and an upper shell 130E includes a portioncorresponding to the cover 1115D of Embodiment 3. In other words, in thepresent embodiment, the housing 100E can be separated into twocomponents, like the housing 100D of Embodiment 3. The housing 100Eincludes: the front shell 110E that is opposed to a circuit board 200,and allows a terminal end portion 201 to protrude; a lower shell 120Cthat is formed integrally with the front shell 110E, and covers oneprincipal surface of the circuit board 200; and the upper shell 130Ethat covers the other principal surface of the circuit board 200, and ismated with the lower shell 120C.

As illustrated in FIG. 22, the front shell 110E includes a body 111E(corresponding to the lower body 1111D of Embodiment 3) and a latch 115.The body (lower body) 111E includes: an opposite 1111E that is opposedto one principal surface of the circuit board 200; a supporter 1112Ehaving a generally cylindrical shape, which rotatably surrounds andsupports both ends of the latch 115; and guides 1113E formed on bothends in the X-axis-direction. The guides 1113E is disposed for locationin the X-axis-direction in the vicinity of the terminal end portion 201of the circuit board 200. The body 111E does not include portionscorresponding to the lower connections 1114D according to Embodiment 3.

The lower shell 120C is formed integrally with the body 111E, and ismated with the upper shell 130E. The lower shell 120C and the body 111Emay be separate from each other.

The upper shell 130E differs from the upper shell 130D in that the uppershell 130E includes a cover 138E corresponding to the cover 1115D of thefront shell 110D of Embodiment 3. Moreover, the upper shell 130E doesnot include the portions to be mated 1116C according to Embodiment 3.For the other respects, the upper shell 130E is similar to the uppershell 130D. As illustrated in FIG. 21B, both the X-axis-direction endsof the cover 138E are arranged at a spacing Z in a direction along afront end 117 (rear end 118 or X-axis-direction) from the guides 1113Eformed on both the X-axis-direction ends of the front shell 110E, andare opposed to the guides 1113E, and any insertion portion is notformed. The cover 138E forms, together with the opposite 1111E and theguides 1113E, a space (corresponding to the insertion portion 1114Caccording to Embodiment 2), and the terminal end portion 201 of thecircuit board 200 is arranged in the space described above.

(Method of Manufacturing Connector 10E)

First, an operator engages both ends of the latch 115 with the supporter1112E of the front shell 110E. Then, the circuit board 200 is placed onthe lower shell 120C via a heat transfer material (not illustrated)while allowing the terminal end portion 201 of the circuit board 200 toprotrude from the front end 117 of the front shell 110E. Then, the uppershell 130E is mated with the lower shell 120C, and a mater 1115C withwhich the latch 115 is engaged is mated with a portion to be mated1116C, to accomplish the connector 10E.

In the connector 10E of the present embodiment, the housing 100E of theconnector 10E is assembled by mating two components, and therefore, theconnector 10E can be more easily manufactured, and can be allowed to besmaller than the connector 10 of Embodiment 1, in which the front shell110, the lower shell 120, and the upper shell 130, which are threecomponents, are assembled.

Each embodiment of the present disclosure has been described above.However, the present disclosure is not limited to the embodimentsdescribed above.

Alternative Example 1

In Embodiment 1 as described above, the circuit board 200 is fixed onthe lower shell 120 with the fixation material 400 having thermalconductivity, as illustrated in FIG. 2B. However, a method of fixing thecircuit board 200 is not limited thereto. Alternative Example 1 in whicha method of fixing a circuit board 200 is different will be describedbelow with reference to FIGS. 13A and 13B. In Alternative Example 1, theshape of a lower shell 120A is different from those in the embodimentsdescribed above. In Alternative Example 1 (and Alternative Example 2)below, description of configurations similar to those in the embodimentsdescribed above is omitted, and respects different from those inEmbodiment 1 are primarily described.

As illustrated in FIGS. 13A and 13B, L-shaped constraint pawls 127 areformed at predetermined spacings by making incisions in parts of a riser122A on the −Y-direction end of the lower shell 120A of the housing 100Aof a connector 10A. The circuit board 200 is arranged on a principalsurface 121 a of the lower shell 120A, and the upper portions of theconstraint pawls 127 are bent in the +Y-direction, whereby, with theconstraint pawls 127, at least a part of a target region (a region otherthan a terminal end portion 201) of one principal surface 204 of thecircuit board 200 is fixed to come into contact with the principalsurface 121 a of the lower shell 120A. Each constraint pawl 127 is anexample of a fixation member. The fixation may also be performed bybending the constraint pawls 127 in advance, and by deforming theconstraint pawls 127 by the circuit board 200 (increasing a distancebetween the constraint pawls 127 and the principal surface 121 a of thelower shell 120A) when the lower shell 120A is locked on the front shell110.

As described above, in Alternative Example 1, the circuit board 200 isfixed on the lower shell 120A with the constraint pawls 127, andtherefore, the need for a spacer for suppressing the unsteadiness of thecircuit board 200 is eliminated. Accordingly, the connector 10A can bedownsized. In Alternative Example 1, at least a part of the targetregion (the region other than the terminal end portion 201) of the oneprincipal surface 204 of the circuit board 200 is fixed to come intocontact with the principal surface 121 a of the lower shell 120A, withthe constraint pawls 127, and therefore, heat from the circuit board 200is dissipated to the outside through the lower shell 120A. Accordingly,the need for the lower shell 120A to include a heat sink for dissipatingheat from the circuit board 200 is reduced, and the connector 10A can bedownsized in a case in which there is no need for a heat sink. InAlternative Example 1, the fixation material 400 is not used between thelower shell 120A and the circuit board 200, and therefore, waiting timebefore the fixation material 400 is solidified is not necessary, wherebytime for which the connector 10A is assembled can be shortened to beable to reduce a manufacturing cost.

Alternative Example 2

Alternative Example 2 of a method of fixing a circuit board 200,different from Embodiment 1 and Alternative Example 1 described above,will be described with reference to FIGS. 14A and 14B, FIGS. 15A and15B, and FIGS. 16A and 16B. In Alternative Example 2, the shapes of alower shell 120B and a circuit board 200A are different from those inthe embodiments described above.

As illustrated in FIGS. 14A and 14B, in the lower shell 120B of thehousing 100B of the connector 10B, insertion pawls 128 in a pair areformed by bending, in the +Z-direction (upward direction), tongue-shapedmembers formed by making generally lateral square-U-shaped incisions ina base 121B in the vicinity of risers 122 on ends in the −Y-direction(backward direction).

As illustrated in FIGS. 15A and 15B, the circuit board 200A includesinsertion holes 206 in a pair at positions corresponding to theinsertion pawls 128 in a pair of the lower shell 120B. As illustrated inFIGS. 16A and 16B, the insertion pawls 128 of the lower shell 120B areinserted into the insertion holes 206. After the insertion, theinsertion pawls 128 are fixed on the circuit board 200A by solder sothat at least a part of a target region (a region other than a terminalend portion 201) of one principal surface 204 of the circuit board 200Acomes into contact with a principal surface 121 a of the lower shell120B. The solder by which the insertion pawls 128 are fixed on thecircuit board 200A is an example of a fixation member.

As described above, in Alternative Example 2, the circuit board 200A isfixed on the lower shell 120B with the insertion pawls 128 and thesolder, and therefore, the need for a spacer for suppressing theunsteadiness of the circuit board 200A is eliminated. Accordingly, theconnector 10B can be downsized. In Alternative Example 2, at least apart of the target region (the region other than the terminal endportion 201) of the one principal surface 204 of the circuit board 200Ais fixed to come into contact with the principal surface 121 a of thelower shell 120B, and therefore, heat from the circuit board 200A isdissipated to the outside through the lower shell 120B. Accordingly, theneed for the lower shell 120B to include a heat sink for dissipatingheat from the circuit board 200A is reduced, and the connector 10B canbe downsized in a case in which there is no need for a heat sink. InAlternative Example 2, the fixation material 400 is not used between thelower shell 120B and the circuit board 200A, and therefore, waiting timebefore the fixation material 400 is solidified is not necessary, wherebytime for which the connector 10B is assembled can be shortened to beable to reduce a manufacturing cost.

Other Alternative Example

In each of the embodiments described above, an example in which theconnector 10 is an AOC connector is described. However, the connector 10may be an electric connector. The semiconductor element 210 may also bea common circuit that does not include a silicon photonics circuit. Itis also acceptable that a signal wire does not include an optical fiber.A configuration in which a connector can be downsized is preferablyacceptable.

In Embodiment 1 and Alternative Examples as described above, the housing100 includes the front shell 110, the lower shell 120, and the uppershell 130 as separate members. However, the front shell 110 and thelower shell 120, or the front shell 110 and the upper shell 130 may beintegrally formed. Since it is not necessary to dispose a connectionportion between the integrally formed shells, a connector can be furtherdownsized. Moreover, the number of steps of manufacturing the connectorand the number of components can be reduced, and shortening of themanufacturing steps and a reduction in cost are thus enabled.

In the embodiments described above, examples in which the insertionopening 135 is disposed in the upper shell 130 are described. However,it is also acceptable that an insertion portion is disposed in a lowershell, and a circuit board is fixed on an upper shell via a fixationmaterial.

In each of the embodiments described above, the reflecting mirror 303 isarranged on the connection 302. However, it is also acceptable that aconnection is connected from the rear to a semiconductor element, and areflecting mirror is arranged on the semiconductor element.

In each of the embodiments described above, the lower shell 120 and theupper shell 130 are mated with each other. However, it is alsoacceptable that ends of a lower shell and an upper shell are thrust ontoeach other, and are fixed to each other by soldering.

In Alternative Example 1 or 2, the fixation members for fixing at leasta part of the target region (the region other than the terminal endportion 201) of the one principal surface 204 of the circuit board 200or 200A to come into contact with the principal surface 121 a of thelower shell 120A or 120B is the constraint pawls 127, or the insertionpawls 128 and solder. However, the fixation may be performed withanother fixation member as long as at least a part of the target regionof the one principal surface 204 of the circuit board can be fixed tocome into contact with the principal surface 121 a of the lower shell.For example, it is also acceptable that the pressers 114 of the frontshell 110 are used as fixation members, and the circuit board 200 isfixed on the lower shell 120 by the force of the pressers 114.Alternatively, it is also acceptable that, for example, a press thatpresses the circuit board 200 against the lower shell 120 and fixes thecircuit board 200 on the lower shell 120 is used as a fixation member,the press is disposed on the upper shell.

In Embodiment 1, 2, and 4 as described above, the tongue 133 is formedon the upper shell 130 or 130C. However, it is also acceptable that aheat radiating plate (heat exchanger plate) is arranged between theupper shell 130, 130C, or 130D, and the semiconductor element 210 of thecircuit board 200.

The foregoing describes some example embodiments for explanatorypurposes. Although the foregoing discussion has presented specificembodiments, persons skilled in the art will recognize that changes maybe made in form and detail without departing from the broader spirit andscope of the invention. Accordingly, the specification and drawings areto be regarded in an illustrative rather than a restrictive sense. Thisdetailed description, therefore, is not to be taken in a limiting sense,and the scope of the invention is defined only by the included claims,along with the full range of equivalents to which such claims areentitled.

This application claims the benefit of Japanese Patent Application No.2019-71593, filed on Apr. 3, 2019, the entire disclosure of which isincorporated by reference herein.

Reference Signs List   1 Connector unit 10, 10A, 10B, 10C, 10D, 10EConnector 20 Mating connector 21 Wall surface 100, 100A, 100B, 100C,100D, 100E Housing 110, 110C, 110D, 110E First shell (front shell) 120,120A, 120B, 120C, 120D Second shell (lower shell) 130, 130C, 130D, 130EThird shell (upper shell) 111, 111C, 111D, 111E Body 111a, 1114CInsertion portion, 111b, 111A, 1111C, 1113D, 1111E Opposite 111c, 111B,1112C, 1115D, 138E Cover 111d, 1113C Connection 112 Portion to beengaged 113 Engagement claw 114 Presser 115 Latch 116a Soldering portion116b Abutment 117 One end (front end) 118 Other end (rear end) 119Recess 121, 121B Base 121a Principal surface 122, 122A Riser 123 Engager124 Engagement hole 125 Protrusion 126 Soldering portion 127 Constraintpawl 128 Insertion pawl 131 Base 132 Riser 133 Tongue 134 Gap 135Insertion opening 136 Engager 137 Abutment 138 Recess 200, 200A Circuitboard 201 Terminal end portion 202 Projection 203 Connection terminal204 One principal surface 205 Other principal surface 206 Insertion hole210 Semiconductor element 211 Principal surface 212 Light emittingelement 213 Light receiving element 300 Signal wire 301 Optical fiber302 Connection 303 Reflecting mirror 400 First heat transfer material(fixation material) 410 Second heat transfer material (heat transfermaterial) 420 Third heat transfer material (heat transfer material) 430Heat exchanger plate 1111D Lower body 1112D Upper body 1112E Supporter1113E Guide 1114D Lower connection 1115C Mater 1116C Portion to be mated1116D Upper connection 1201C Signal wire insertion portion 1201D Lockingpawl 1202C Signal wire abutment 1203C Signal wire insertion hole 1204CPortion to be locked 1301C Locker

1. A connector comprising: a circuit board that is connected to anoutside via a signal wire; a first heat transfer material that isarranged on one principal surface of the circuit board; a first shell ofwhich one end is mated with a mating connector in a state in which aterminal end portion of the circuit board protrudes from the one end,and which comprises an opposite opposed to at least a part of a targetregion which is a region other than the terminal end portion of thecircuit board, covers at least a part of the target region, and isconductive; a second shell that is connected to another end of the firstshell, covers at least a part of the target region in the one principalsurface of the circuit board, is thermally conductably connected to thecircuit board in contact with the first heat transfer material, and isconductive; and a third shell that is engaged with the second shell,covers at least a part of the target region in another principal surfaceof the circuit board, and is conductive, wherein the first shell, thesecond shell, and the third shell cover the target region of the circuitboard.
 2. The connector according to claim 1, wherein the third shell isspaced from the first shell in a direction along the one end, or in adirection along a thickness direction of the circuit board, and opposedto the target region of the circuit board.
 3. The connector according toclaim 1, wherein the first shell comprises a cover that is connected tothe opposite, and forms, together with the opposite, an insertionportion, and the terminal end portion of the circuit board is insertedinto the insertion portion.
 4. The connector according to claim 1,wherein the first shell is formed integrally with the second shell. 5.The connector according to claim 4, wherein the first shell is furtherformed integrally with the third shell.
 6. The connector according toclaim 1, wherein a heat generation member is arranged on the otherprincipal surface of the circuit board, and a part of the third shell isthermally conductably connected to the heat generation member via asecond heat transfer material.
 7. The connector according to claim 6,wherein a tongue is formed in the third shell, and the tongue is bent incontact with the second heat transfer material.
 8. The connectoraccording to claim 6, wherein the heat generation member is thermallyconductably connected to the circuit board via a third heat transfermaterial.
 9. The connector according to claim 6, wherein the heatgeneration member comprises a semiconductor element comprising a siliconphotonics circuit.
 10. The connector according to claim 9, wherein thesignal wire comprises an optical fiber, the optical fiber is connectedto a light emitting element or light receiving element included in thesemiconductor element, and an electric terminal of the semiconductorelement is connected to a plurality of connection terminals arranged onthe terminal end portion via a wiring line formed on the circuit board.11. The connector according to claim 1, wherein the second shell or thethird shell comprises an engager arranged on one end thereof, and thefirst shell comprises a portion to be engaged, which is arranged on theother end, and is engaged with the engager.
 12. The connector accordingto claim 1, wherein the first shell comprises: an engagement claw thatis engaged with the circuit board; and a presser that presses the otherprincipal surface of the circuit board.
 13. The connector accordingclaim 1, wherein an insertion opening into which the signal wire isinserted is opened in at least one of the second shell and the thirdshell.
 14. The connector according to claim 1, wherein the first heattransfer material is a fixation material with which the circuit board isfixed on the second shell.
 15. A connector comprising: a circuit boardthat is connected to an outside via a signal wire; a fixation memberwith which fixation of the circuit board is performed; a first shell ofwhich one end is mated with a mating connector in a state in which aterminal end portion of the circuit board protrudes from the one end,and which covers at least a part of a target region which is a regionother than the terminal end portion of the circuit board, and isconductive; a second shell that is connected to another end of the firstshell, covers at least a part of the target region in one principalsurface of the circuit board, and is conductive; and a third shell thatis connected to the other end of the first shell, is engaged with thesecond shell, covers at least a part of the target region in anotherprincipal surface of the circuit board, and is conductive, wherein thefirst shell, the second shell, and the third shell cover the targetregion of the circuit board, and the fixation is performed with thefixation member so that at least a part of the target region in the oneprincipal surface of the circuit board comes into contact with aprincipal surface of the second shell.
 16. (canceled)
 17. A connectorcomprising: a circuit board that is connected to an outside via a signalwire; a thermally-conductive fixation material that is arranged on oneprincipal surface of the circuit board; a first shell in which aninsertion portion into which a terminal end portion of the circuit boardis inserted is formed on one end, of which the one end is mated with amating connector in a state in which the terminal end portion of thecircuit board protrudes from the one end, and which covers at least apart of a target region which is a region other than the terminal endportion of the circuit board, and is conductive; a second shell that isconnected to another end of the first shell, covers at least a part ofthe target region in the one principal surface of the circuit board,comes into contact with the fixation material to perform fixation of thecircuit board, and is conductive; and a third shell that is connected tothe other end of the first shell, is engaged with the second shell,covers at least a part of the target region in another principal surfaceof the circuit board, and is conductive, wherein the first shell, thesecond shell, and the third shell cover the target region of the circuitboard.
 18. The connector according to claim 2, wherein the first shellis formed integrally with the second shell.
 19. The connector accordingto claim 18, wherein the first shell is further formed integrally withthe third shell.
 20. The connector according to claim 3, wherein thefirst shell is formed integrally with the second shell.
 21. Theconnector according to claim 20, wherein the first shell is furtherformed integrally with the third shell.